Fusion PCBA Specification | |||||||||||||
Order Quantity | 1-8000pcs | ||||||||||||
PCB Layers | 1-16 layers | ||||||||||||
PCB Material | Rigid, Aluminum, Flexible Printed Circuit | ||||||||||||
Components | Seeed OPL | ||||||||||||
Components from Official Suppliers like Digikey, Mouser, Arrow, Element14 and others. They must satisfy the following criteria: 1). Must be allowed to be imported into Mainland China 2). Must be in stock or have a certain lead time 3). Must be available in small quantities or in the specified quantity. | |||||||||||||
Environmental standard | RoHS (Lead Free) | ||||||||||||
Solder Type | Manual Soldering/Surface Mounted Technology | ||||||||||||
Board dimensions | Minimum Size: 1.0mm*1.0mm | ||||||||||||
Maximum Size: 500mm*500mm | |||||||||||||
Board Shape | Various Shapes | ||||||||||||
PCB Design File Format | Gerber File | ||||||||||||
BOM (Bill of Materials) | 1. BOM file should be in csv, xls, xlsx format 2. BOM content should be as below
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1 | We can assembly both sides (Components can be soldered on the top and bottom sides). |
2 | If possible, please provide us with a pick and place file (XY or Centroid file) in the PCB Gerber zip file. |
3 | Shipping is FREE to anywhere in the world for PCBA orders. |
4 | Stencils are included in PCBA orders but they are not shipped with the boards due to the high shipping costs. If you need stencils, please order them separately. |
5 | If possible, please keep all through-hole components on the same side (top or bottom). |
6 | The distance between 2 solder pads of 0402 components should be 0.26-0.45mm. |
7 | Please ensure that designator labels on the silkscreen are not on top of pads or vias since any overlapping silkscreen is removed during PCB manufacture. |
8 | Please clearly mark the pole for polarised components. |
9 | Minimum trace/vias/pads spacing is 4mil |
10 | The distance between any two chip components should be at least 1mm; the distance between chip components and connectors should be at least 5mm |
11 | Please maintain a clearance of 3.8mm around large ICs (48pins or more) and BGAs. The minimum BGA is 0.25mm |
12 | The solder pad size (length/width) on PCB should be larger than the pin size of the component |
13 | Temperature-sensitive components (e.g. LED, battery) may be damaged in the manual soldering process |
14 | The distance between soldering points and neighbouring SMD components should be at least 1mm |
Part/Designator | Manufacturer Part Number/Seeed SKU |
Quantity |
A4,C2,C3 | 318020010 | 3 |
C1,C2,C3,C4,C5 | RHA0J471MCN1GS | 5 |
D1 | ESP-WROOM-02 | 1 |
The lead time for PCB Assembly orders is around 7-15 business days if all the parts are from the Seeed's OPL and around 20-25 business days if not. Please see below for details.
The component package in the uploaded BOM should match the pads in the Gerber file.
Polarised components should have clear indications to their polarity on the silkscreen. Otherwise, the components may be incorrectly mounted.
Notice: Please examine the files carefully before placing an order. We are not able to change the Gerber files once PCB fabrication begins.