Fusion Advanced PCB Specification
The Seeed Fusion Advanced PCB service caters for more complex requirements.
Material |
FR4 | TG130/TG170 | |
| High Frequency Board | Default (if not otherwise
specified) |
TG170 | |
| Please
request when placing the order |
Rogers, Taconic,
Arlon, Rogers 4350, Rogers 4003, 25FR, 25N |
||
| Rigid PI | |||
| Aluminum Board | |||
| Number of Layers | FR4 | 1 - 30 layers | |
| Rigid-Flex | 36 Rigid layers/10 flexible layers | ||
| FPC | 1 - 10 layers | ||
| Metal Board | 1 - 2 layers | ||
| Board Thickness | Rigid | 0.2 - 8.0mm | |
| Aluminium Board | 0.5 - 7.0mm | ||
| Surface Finishes | HASL, HASL (Lead-free), ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP | ||
| Copper Trace Width / Spacing | Inner layer | For 0.5oz Copper Weight | 3/3mil |
| For 1oz Copper Weight | 4/4mil | ||
| For 2oz Copper Weight | 5/6mil | ||
| For 3oz Copper Weight | 7/9mil | ||
| For 4oz Copper Weight | 8/12mil | ||
| For 5oz Copper Weight | 10/15mil | ||
| For 6oz Copper Weight | 12/18mil | ||
| Outer layer | For 1/3oz Copper Weight | 3/3mil | |
| For 0.5oz Copper Weight | 4/4mil | ||
| For 1oz Copper Weight | 5/5mil | ||
| For 2oz Copper Weight | 6/8mil | ||
| For 3oz Copper Weight | 7/10mil | ||
| For 4oz Copper Weight | 8/13mil | ||
| For 5oz Copper Weight | 10/16mil | ||
| For 6oz Copper Weight | 12/18mil | ||
| Minimum Mechanical Via Diameter | 0.1mm (PCB thickness ≤0.6mm) | ||
| Minimum Castellated Holes Diameter | Φ 0.35mm | ||
| Minimum
Spacing Between Via walls (of different circuit nets) |
9mil for prototype 12mil for mass production | ||
| Minimum
Spacing Between Vias and Traces in Inner Layers |
9mil for prototype 12mil for mass production | ||
| Width of Annular Rings | For vias | 4mil | |
| For Through-Holes | 8mil | ||
| Minimum
Width of the Solder Mask Dam |
Green Solder Mask | 0.08mm | |
| Other Colors | 0.12mm | ||
| Solder Mask Colors | Green / Red / Yellow / Blue / White / Purple / Matte Green / Customized | ||
| HDI Boards (Buried/Blind Vias) | 1+n+1 | ||
| 1+1+n+1+1 | |||
| 2+n+2 | |||
| 1+1+1+n+1+1+1 | |||
| Mechanical Tolerances | Outline | ±0.10mm | |
| V-cuts | ±0.10mm | ||
| Milling Slots | ±0.10mm | ||
| Gold Finger | Edge Chamfer | 20°, 30° ,45° ,60° | |
| Edge Chamfer tolerance | ±5° | ||
| Minimum Spacing | 7mil | ||
| Plugged Vias | Diameter (finished) | 0.15-0.8mm | |
| Thickness/Diameter | ≤16:1 | ||
| Trace/Spacing | 4/4mil | ||
| Back Drilling | Diameter | 0.5-6.3mm | |
| Distance Between Adjacent Layers |
≥0.20mm | ||
| Depth Tolerance | ±0.10mm | ||
| Min BGA | Diameter | 7mil | |
| Trace/Spacing | 4/4mil | ||
| Trace tolerance | Trace Width ≤ 10mil | ±1.0mil | |
| Trace Width＞10mil | ±1.5mil | ||
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